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Cleaning


Removal of excessive solder alloy by polishing

Removal of excessive solder alloy by polishing

To avoid corrosion, soldered items should be cleaned as soon as possible after the soldering process. This will make the plating process significantly easier. Care must be taken when using mechanical polishing devices. Polishing media that are too hard or drums that rotate too quickly can damage the items and the crystals. Check the quantity, the polishing agents and time, the rotating speed, and the height of the fall, in order to keep mechanical stress levels as low as possible. In order to preserve the high quality of the creations, we recommend not using organic solvents and not exceeding a maximum temperature of 100 °C (212 °F).